Keyphrases
Actuator
17%
Bulk Micromachining
21%
Cadmium Telluride
100%
CdZnTe Spectrometer
16%
CMOS Technology
31%
CMOS Transistor
31%
CMOS-MEMS
23%
Complementary Metal Oxide Semiconductor
31%
Diode
18%
Electrical Properties
19%
Electrostatic Actuator
38%
Epilayer
37%
Excess Carrier Lifetime
17%
Gas Sensor
17%
Hg1-xCdxTe
55%
HgCdTe
50%
HgCdTe Photodiodes
18%
High Performance
19%
InSb
17%
Interface Charge
18%
ISFET
27%
Metal-organic Chemical Vapor Deposition (MOCVD)
65%
Micro-electro-mechanical Systems
16%
Microcantilever
21%
Micromachining
55%
Mobility-lifetime Product
17%
MOS Transistor
16%
Muzzle Flash Detection
16%
Native Oxide
17%
Noise Measurement
20%
Optical Sensing
22%
P-type
43%
Passivation
19%
Photodiode
44%
Photoluminescence
26%
Porous Silicon
68%
Porous Silicon Layer
22%
Pull-in Parameters
24%
Semiconductors
29%
Sensor-based
31%
Silicon-on-insulator
23%
Single Photon Avalanche Diode
35%
SOI CMOS
60%
SOI Wafer
20%
Spectrometer
24%
Standard CMOS Technology
23%
Subthreshold
23%
Thermal Sensor
41%
Transistor
59%
Uncooled
56%
Engineering
Analog Circuit
12%
Antenna
14%
Bias Voltage
15%
Carrier Lifetime
13%
Chemical Vapor Deposition
25%
Collection Efficiency
19%
Complementary Metal-Oxide-Semiconductor
27%
Current-Voltage Characteristic
14%
Defects
17%
Dielectrics
18%
Electrostatics
55%
Energy Engineering
19%
Experimental Result
14%
Floating Gate
14%
Focal Plane
19%
Frequency Noise
14%
Gamma Ray
23%
Gas Mixture
11%
Gas Sensor
24%
Gas-Phase
14%
Gate Voltage
11%
Heterojunctions
12%
Image Sensor
33%
Integration Time
11%
Internet of Things
12%
Ion-Sensitive Field Effect Transistor
18%
Measurement Noise
25%
Metal-Oxide-Semiconductor Field-Effect Transistor
12%
Micro Machining
37%
Microcantilevers
24%
Microelectromechanical System
87%
Micromirrors
11%
Microsystem
12%
Optimal Design
15%
Passivation
26%
Photodiode
53%
Polysilicon
14%
Porous Silicon
50%
Proof Mass
14%
Resistive
14%
Reverse Bias
12%
Sensing Element
12%
Sensing System
15%
Silicon on Insulator
22%
Substrate Material
12%
Thermal Sensor
47%
Thermoelectrics
14%
Tunnel Construction
21%
Two Dimensional
18%
Vapor Deposition
25%