TY - GEN
T1 - Analytic model of the deflection of piezoelectric unimorph and bimorph structures with numerical verification
AU - Elata, David
AU - Elka, Eyal
AU - Abramovich, Haim
PY - 2006
Y1 - 2006
N2 - The constitutive equations of multi-layered piezoelectric structures are derived in a new form. In this form, the electromechanical coupling is presented as an additional stiffness matrix. This matrix is a true property of the piezoelectric structure and is independent of specific mechanical boundary conditions that may apply to the structure. A novel model of the electromechanical response of such structures is presented. This model accounts for the 3D kinematics of the structure deformation. Solution of example problems using the new model shows excellent agreement with full 3D finite element simulations. These solutions are also compared with the results of previous 2D model approximations presented in literature, and the inaccuracies associated with these previous models are discussed.
AB - The constitutive equations of multi-layered piezoelectric structures are derived in a new form. In this form, the electromechanical coupling is presented as an additional stiffness matrix. This matrix is a true property of the piezoelectric structure and is independent of specific mechanical boundary conditions that may apply to the structure. A novel model of the electromechanical response of such structures is presented. This model accounts for the 3D kinematics of the structure deformation. Solution of example problems using the new model shows excellent agreement with full 3D finite element simulations. These solutions are also compared with the results of previous 2D model approximations presented in literature, and the inaccuracies associated with these previous models are discussed.
UR - https://www.scopus.com/pages/publications/33847142840
U2 - 10.1109/ESIME.2006.1643989
DO - 10.1109/ESIME.2006.1643989
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AN - SCOPUS:33847142840
SN - 1424402751
SN - 9781424402755
T3 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
BT - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
T2 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
Y2 - 24 April 2006 through 26 April 2006
ER -