Abstract
We report the design (electrical, mechanical, and thermal) and characterization of an improved performance uncooled thermal sensor for THz radiation based on thermal antenna. The 2-D imager pixel array provides the periodicity and constitutes a frequency-selective surface tuned to the desired THz wavelength band. The focal-plane array is first fabricated in a matured 0.18-μm CMOS-Silicon Over Insulator (SOI) process. By applying MEMS postprocessing using the CMOS metallization layers as built-in masks, micromachined-suspended directly absorbing resistive antennae integrated with thermal sensors are obtained, thus achieving good thermal isolation as well as low thermal mass. Characterization is performed using blackbody operating at 900-1200 K and THz filters. In contrast to the earlier published results, the reported device is characterized with a fully blocking set of three THz filters. With the current responsivity of ∼ 2.6 A/W, Noise Equivalent Power (NEP) of the order of NEP Hz |1Hz= 6.1 pW Hz, D of 0.41 1010 cm Hz/W, this uncooled THz sensor in the standard CMOS-SOI technology may enable monolithic uncooled passive THz imagers.
Original language | English |
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Article number | 7403955 |
Pages (from-to) | 1260-1265 |
Number of pages | 6 |
Journal | IEEE Transactions on Electron Devices |
Volume | 63 |
Issue number | 3 |
DOIs | |
State | Published - Mar 2016 |
Keywords
- CMOS
- MOS devices
- Silicon Over Insulator
- THz sensors
- frequency-selective surfaces (FSSs)
- microfabrication
- micromechanical devices
- microsensors
- thermal sensors
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering