TY - GEN
T1 - CMOS-SOI-MEMS transistor (TeraMOS) for Terahertz Imaging
AU - Corcos, D.
AU - Goren, D.
AU - Nemirovsky, Y.
PY - 2009
Y1 - 2009
N2 - This study presents a new sensor for Terahertz Imaging, dubbed here as TeraMOS, which is based on several leading technologies: CMOS-SOI (Silicon on Insulator), MEMS (Micro Electro Mechanical Systems) and Terahertz Photonics. The paper focuses on the electrical characterization of CMOS-SOI "virgin" (unreleased) transistors fabricated in the IBM 0.18μm RF CMOS-SOI advanced process. By applying MEMS post processing to thermally isolate the transistors, the resulting CMOS-SOI-MEMS transistors become highly sensitive active bolometers - the TeraMOS sensors. The measured Temperature Coefficient of Current (TCC) as a function of temperature, gate voltage and drain current is presented. A new suggested figure of merit for the TeraMOS sensors is defined by TCC2·I and measured values of it are presented.
AB - This study presents a new sensor for Terahertz Imaging, dubbed here as TeraMOS, which is based on several leading technologies: CMOS-SOI (Silicon on Insulator), MEMS (Micro Electro Mechanical Systems) and Terahertz Photonics. The paper focuses on the electrical characterization of CMOS-SOI "virgin" (unreleased) transistors fabricated in the IBM 0.18μm RF CMOS-SOI advanced process. By applying MEMS post processing to thermally isolate the transistors, the resulting CMOS-SOI-MEMS transistors become highly sensitive active bolometers - the TeraMOS sensors. The measured Temperature Coefficient of Current (TCC) as a function of temperature, gate voltage and drain current is presented. A new suggested figure of merit for the TeraMOS sensors is defined by TCC2·I and measured values of it are presented.
KW - CMOS
KW - MOS transistors
KW - Silicon-on-Insulator (SOI)
KW - Temperature Coefficient of Current (TCC)
KW - Terahertz sensors
UR - http://www.scopus.com/inward/record.url?scp=77949868047&partnerID=8YFLogxK
U2 - 10.1109/COMCAS.2009.5386033
DO - 10.1109/COMCAS.2009.5386033
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AN - SCOPUS:77949868047
SN - 9781424439850
T3 - 2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, COMCAS 2009
BT - 2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, COMCAS 2009
T2 - 2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, COMCAS 2009
Y2 - 9 November 2009 through 11 November 2009
ER -