CMOS-SOI-MEMS transistor (TeraMOS) for Terahertz Imaging

D. Corcos, D. Goren, Y. Nemirovsky

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This study presents a new sensor for Terahertz Imaging, dubbed here as TeraMOS, which is based on several leading technologies: CMOS-SOI (Silicon on Insulator), MEMS (Micro Electro Mechanical Systems) and Terahertz Photonics. The paper focuses on the electrical characterization of CMOS-SOI "virgin" (unreleased) transistors fabricated in the IBM 0.18μm RF CMOS-SOI advanced process. By applying MEMS post processing to thermally isolate the transistors, the resulting CMOS-SOI-MEMS transistors become highly sensitive active bolometers - the TeraMOS sensors. The measured Temperature Coefficient of Current (TCC) as a function of temperature, gate voltage and drain current is presented. A new suggested figure of merit for the TeraMOS sensors is defined by TCC2·I and measured values of it are presented.

Original languageEnglish
Title of host publication2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, COMCAS 2009
DOIs
StatePublished - 2009
Event2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, COMCAS 2009 - Tel Aviv, Israel
Duration: 9 Nov 200911 Nov 2009

Publication series

Name2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, COMCAS 2009

Conference

Conference2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, COMCAS 2009
Country/TerritoryIsrael
CityTel Aviv
Period9/11/0911/11/09

Keywords

  • CMOS
  • MOS transistors
  • Silicon-on-Insulator (SOI)
  • Temperature Coefficient of Current (TCC)
  • Terahertz sensors

ASJC Scopus subject areas

  • Computational Theory and Mathematics
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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