TY - GEN
T1 - Design and simulations of CMOS-SOI-NEMS thermal antenna and sensors for passive uncooled THz imaging
AU - Svetlitza, Alexander
AU - Blank, Tanya
AU - Stolyarova, Sara
AU - Brouk, Igor
AU - Bar-Lev, Sharon
AU - Nemirovsky, Yael
N1 - Publisher Copyright:
© Copyright 2015 IEEE All rights reserved.
PY - 2014
Y1 - 2014
N2 - The paper presents design considerations of an innovative uncooled passive THz imaging sensor based on thermal antenna. The 2D imager pixel array, where each pixel size is of the order of the THz wavelength, provides the periodicity and constitutes a frequency selective surface tuned to the desired THz wavelength band. The uncooled passive THz sensors are implemented in cost-effective CMOS-SOI-NEMS technology. The focal plane array is first fabricated in a matured 0.18μm CMOS-SOI process. By applying NEMS post-processing using the CMOS metallization layers as built-in masks, nano-machined suspended directly-absorbing resistive antennas integrated with thermal sensors are obtained, thus achieving good thermal isolation as well as low thermal mass.
AB - The paper presents design considerations of an innovative uncooled passive THz imaging sensor based on thermal antenna. The 2D imager pixel array, where each pixel size is of the order of the THz wavelength, provides the periodicity and constitutes a frequency selective surface tuned to the desired THz wavelength band. The uncooled passive THz sensors are implemented in cost-effective CMOS-SOI-NEMS technology. The focal plane array is first fabricated in a matured 0.18μm CMOS-SOI process. By applying NEMS post-processing using the CMOS metallization layers as built-in masks, nano-machined suspended directly-absorbing resistive antennas integrated with thermal sensors are obtained, thus achieving good thermal isolation as well as low thermal mass.
KW - Absorber
KW - Frequency selective surfaces (FSS)
KW - NEMS
KW - THz imaging
KW - Thermal sensors
UR - http://www.scopus.com/inward/record.url?scp=84941254854&partnerID=8YFLogxK
U2 - 10.1109/EEEI.2014.7005762
DO - 10.1109/EEEI.2014.7005762
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AN - SCOPUS:84941254854
T3 - 2014 IEEE 28th Convention of Electrical and Electronics Engineers in Israel, IEEEI 2014
BT - 2014 IEEE 28th Convention of Electrical and Electronics Engineers in Israel, IEEEI 2014
T2 - 2014 28th IEEE Convention of Electrical and Electronics Engineers in Israel, IEEEI 2014
Y2 - 3 December 2014 through 5 December 2014
ER -