TY - GEN
T1 - Exploring Charge Trapping Dynamics in Si:HfO-FeFETs by Temperature-Dependent Electrical Characterization
AU - Dahan, Mor Mordechai
AU - Ber, Emanuel
AU - Levit, Or
AU - Mulaosmanovic, Halid
AU - Dunkel, Stefan
AU - Muller, Johannes
AU - Beyer, Sven
AU - Yalon, Eilam
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Ferroelectric HfO2 technology shows promise for non-volatile memory and neuromorphic devices. However, charge trapping limits their performance. This work presents temperature-dependent electrical characterization that reveals distinct memory window behaviors, transitioning from ferroelectric to trapping. Our measurements span six orders of magnitude in time, and ambient temperatures of 80-300 K. Analysis of threshold voltage, memory window, and de-trapping dynamics extracts a trap energy level of 0.2 eV, providing crucial insights for advancing FE HfO2-based FeFETs technology.
AB - Ferroelectric HfO2 technology shows promise for non-volatile memory and neuromorphic devices. However, charge trapping limits their performance. This work presents temperature-dependent electrical characterization that reveals distinct memory window behaviors, transitioning from ferroelectric to trapping. Our measurements span six orders of magnitude in time, and ambient temperatures of 80-300 K. Analysis of threshold voltage, memory window, and de-trapping dynamics extracts a trap energy level of 0.2 eV, providing crucial insights for advancing FE HfO2-based FeFETs technology.
KW - charge trapping
KW - cryogenic measurements
KW - FeFET
KW - read-after-write delay
KW - Si:HfO
KW - trap energy level
UR - http://www.scopus.com/inward/record.url?scp=85193228717&partnerID=8YFLogxK
U2 - 10.1109/EDTM58488.2024.10512141
DO - 10.1109/EDTM58488.2024.10512141
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AN - SCOPUS:85193228717
T3 - IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024
BT - IEEE Electron Devices Technology and Manufacturing Conference
T2 - 8th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2024
Y2 - 3 March 2024 through 6 March 2024
ER -