High vacuum wafer level packaging for uncooled infrared sensor

Mikel Azpeitia Urquia; Giorgio Allegato; Stefano Paleari; Francesco Tripodi; Laura Oggioni; Matteo Garavaglia; Yael Nemirovsky; Tanya Blank

doi:10.1109/DTIP51112.2020.9139148

High vacuum wafer level packaging for uncooled infrared sensor

Mikel Azpeitia Urquia, Giorgio Allegato, Stefano Paleari, Francesco Tripodi, Laura Oggioni, Matteo Garavaglia, Yael Nemirovsky, Tanya Blank

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

High vacuum packaging is a key factor for MEMS based uncooled infrared sensors in order to enhance sensitivity and optimize device performances. In this paper a high vacuum, low cost and reliable wafer-level package (WLP) architecture for a MOS based infrared sensor is presented, based on a double wafer bonding process and a getter layer integration. Vacuum level of the WLP was electrically characterized with positive results, confirming vacuum level value lower than 10μ bar.

Original language	English
Title of host publication	2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2020
ISBN (Electronic)	9781728189017
DOIs	https://doi.org/10.1109/DTIP51112.2020.9139148
State	Published - Jun 2020
Event	2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2020 - Lyon, France Duration: 15 Jun 2020 → 26 Jun 2020

Publication series

Name	2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2020

Conference

Conference	2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2020
Country/Territory	France
City	Lyon
Period	15/06/20 → 26/06/20

Keywords

Electrical Measurement
Getter
High Vacuum
Infrared Sensor
MEMS
Process Control
Wafer level Packaging

ASJC Scopus subject areas

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Mechanical Engineering
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials
Instrumentation

Access to Document

10.1109/DTIP51112.2020.9139148

Cite this

Urquia, M. A., Allegato, G., Paleari, S., Tripodi, F., Oggioni, L., Garavaglia, M., Nemirovsky, Y., & Blank, T. (2020). High vacuum wafer level packaging for uncooled infrared sensor. In 2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2020 Article 9139148 (2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2020). https://doi.org/10.1109/DTIP51112.2020.9139148

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keywords = "Electrical Measurement, Getter, High Vacuum, Infrared Sensor, MEMS, Process Control, Wafer level Packaging",

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Urquia, MA, Allegato, G, Paleari, S, Tripodi, F, Oggioni, L, Garavaglia, M, Nemirovsky, Y & Blank, T 2020, High vacuum wafer level packaging for uncooled infrared sensor. in 2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2020., 9139148, 2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2020, 2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2020, Lyon, France, 15/06/20. https://doi.org/10.1109/DTIP51112.2020.9139148

High vacuum wafer level packaging for uncooled infrared sensor. / Urquia, Mikel Azpeitia; Allegato, Giorgio; Paleari, Stefano et al.
2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2020. 2020. 9139148 (2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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Urquia MA, Allegato G, Paleari S, Tripodi F, Oggioni L, Garavaglia M et al. High vacuum wafer level packaging for uncooled infrared sensor. In 2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2020. 2020. 9139148. (2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2020). doi: 10.1109/DTIP51112.2020.9139148

High vacuum wafer level packaging for uncooled infrared sensor

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

Access to Document

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