Modeling, design, and fabrication of uncooled IR CMOS compatible thermoelectric sensors

Eran Socher; Yehuda Sinai; Ofir Bochobza-Degani; Yael Nemirovsky

doi:10.1117/12.468669

Modeling, design, and fabrication of uncooled IR CMOS compatible thermoelectric sensors

Eran Socher, Yehuda Sinai, Ofir Bochobza-Degani, Yael Nemirovsky

Research output: Contribution to journal › Conference article › peer-review

Abstract

We present a novel dry micromachining technique for the release of the thermally isolated spiral thermocouples, which achieve the highest thermal resistance for a rectangular pixel with a fixed size. The sensors are fabricated using mask-less post-processing of standard CMOS chips that contain CMOS readout electronics. Basic ID thermal modeling of the sensors is presented and its limitations. Analysis of the performance of the sensors is derived from the modeling. Mechanical resonant frequencies for the structures are also shown. Design of such sensors in standard CMOS technology is reviewed, as well as results of fabricated devices. Fabricated devices include single elements and arrays up to 32*32 elements with pixel size and pitch of several tens of microns.

Original language	English
Pages (from-to)	736-743
Number of pages	8
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	4820
Issue number	2
DOIs	https://doi.org/10.1117/12.468669
State	Published - 2002
Event	Infrared Technology and Applications XXVIII - Seattle, WA, United States Duration: 7 Jul 2002 → 11 Jul 2002

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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10.1117/12.468669

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abstract = "We present a novel dry micromachining technique for the release of the thermally isolated spiral thermocouples, which achieve the highest thermal resistance for a rectangular pixel with a fixed size. The sensors are fabricated using mask-less post-processing of standard CMOS chips that contain CMOS readout electronics. Basic ID thermal modeling of the sensors is presented and its limitations. Analysis of the performance of the sensors is derived from the modeling. Mechanical resonant frequencies for the structures are also shown. Design of such sensors in standard CMOS technology is reviewed, as well as results of fabricated devices. Fabricated devices include single elements and arrays up to 32*32 elements with pixel size and pitch of several tens of microns.",

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AU - Nemirovsky, Yael

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AB - We present a novel dry micromachining technique for the release of the thermally isolated spiral thermocouples, which achieve the highest thermal resistance for a rectangular pixel with a fixed size. The sensors are fabricated using mask-less post-processing of standard CMOS chips that contain CMOS readout electronics. Basic ID thermal modeling of the sensors is presented and its limitations. Analysis of the performance of the sensors is derived from the modeling. Mechanical resonant frequencies for the structures are also shown. Design of such sensors in standard CMOS technology is reviewed, as well as results of fabricated devices. Fabricated devices include single elements and arrays up to 32*32 elements with pixel size and pitch of several tens of microns.

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Modeling, design, and fabrication of uncooled IR CMOS compatible thermoelectric sensors

Abstract

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