Modeling the thermal performance of a packaged MEMS thermal sensor at wide pressure range for IoT applications

Moshe Avraham; Ayal Shabtay; Dima Shlenkevitch; Sara Stolyarova; Tanya Blank; Yael Nemirovsky

doi:10.1109/COMCAS44984.2019.8958080

Modeling the thermal performance of a packaged MEMS thermal sensor at wide pressure range for IoT applications

Moshe Avraham, Ayal Shabtay, Dima Shlenkevitch, Sara Stolyarova, Tanya Blank, Yael Nemirovsky

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

This paper focuses on the thermal performance of a wafer level packaged MEMS thermal sensor, where the pressure varies between deep vacuum (0.1 Pa) and atmospheric pressure. The simulations are based on commercial software and are corroborated by modeling and measurements. There is a good agreement between the measured experimental data for the thermal time constant and the modeling and simulations.

Original language	English
Title of host publication	2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019
ISBN (Electronic)	9781538695494
DOIs	https://doi.org/10.1109/COMCAS44984.2019.8958080
State	Published - Nov 2019
Event	2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019 - Tel-Aviv, Israel Duration: 4 Nov 2019 → 6 Nov 2019

Publication series

Name	2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019

Conference

Conference	2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019
Country/Territory	Israel
City	Tel-Aviv
Period	4/11/19 → 6/11/19

Keywords

Gas conduction at intermediate pressure
MEMS sensors
TMOS
Thermal sensors
Wafer-level packaging

ASJC Scopus subject areas

Information Systems and Management
Electrical and Electronic Engineering
Instrumentation
Artificial Intelligence
Computer Networks and Communications

Access to Document

10.1109/COMCAS44984.2019.8958080

Cite this

Avraham, M., Shabtay, A., Shlenkevitch, D., Stolyarova, S., Blank, T., & Nemirovsky, Y. (2019). Modeling the thermal performance of a packaged MEMS thermal sensor at wide pressure range for IoT applications. In 2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019 Article 8958080 (2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019). https://doi.org/10.1109/COMCAS44984.2019.8958080

Avraham, Moshe ; Shabtay, Ayal ; Shlenkevitch, Dima et al. / Modeling the thermal performance of a packaged MEMS thermal sensor at wide pressure range for IoT applications. 2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019. 2019. (2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019).

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title = "Modeling the thermal performance of a packaged MEMS thermal sensor at wide pressure range for IoT applications",

abstract = "This paper focuses on the thermal performance of a wafer level packaged MEMS thermal sensor, where the pressure varies between deep vacuum (0.1 Pa) and atmospheric pressure. The simulations are based on commercial software and are corroborated by modeling and measurements. There is a good agreement between the measured experimental data for the thermal time constant and the modeling and simulations.",

keywords = "Gas conduction at intermediate pressure, MEMS sensors, TMOS, Thermal sensors, Wafer-level packaging",

author = "Moshe Avraham and Ayal Shabtay and Dima Shlenkevitch and Sara Stolyarova and Tanya Blank and Yael Nemirovsky",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019 ; Conference date: 04-11-2019 Through 06-11-2019",

year = "2019",

month = nov,

doi = "10.1109/COMCAS44984.2019.8958080",

language = "אנגלית",

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Avraham, M, Shabtay, A, Shlenkevitch, D, Stolyarova, S, Blank, T & Nemirovsky, Y 2019, Modeling the thermal performance of a packaged MEMS thermal sensor at wide pressure range for IoT applications. in 2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019., 8958080, 2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019, 2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019, Tel-Aviv, Israel, 4/11/19. https://doi.org/10.1109/COMCAS44984.2019.8958080

Modeling the thermal performance of a packaged MEMS thermal sensor at wide pressure range for IoT applications. / Avraham, Moshe; Shabtay, Ayal; Shlenkevitch, Dima et al.
2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019. 2019. 8958080 (2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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Avraham M, Shabtay A, Shlenkevitch D, Stolyarova S, Blank T, Nemirovsky Y. Modeling the thermal performance of a packaged MEMS thermal sensor at wide pressure range for IoT applications. In 2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019. 2019. 8958080. (2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019). doi: 10.1109/COMCAS44984.2019.8958080

Modeling the thermal performance of a packaged MEMS thermal sensor at wide pressure range for IoT applications

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