TY - GEN
T1 - New Sensing Systems for Securing Virtual Walls at Outdoor Based on True Differential Digital TMOS
AU - Blank, Tanya
AU - Brouk, Igor
AU - Bar-Lev, Sharon
AU - Amar, Gavriel
AU - Meltsin, Maxim
AU - Katz, Alex
AU - Vaiana, Michele
AU - Castagna, Maria Eloisa
AU - Malfa, Antonella La
AU - Bruno, Giuseppe
AU - Nemirovsky, Yael
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - This paper presents a non-imaging differential digital passive Infra-Red (PIR) remote sensing system using CMOS-SOI-MEMS transistors as the thermal sensor. A large 660mu {mathrm m}, {mathrm x}, 660mu{mathrm m} pixel area is developed by the 8x8 mosaic matrix of 60mu {mathrm m} ,{mathrm x}, 60mu{mathrm m} sub-pixels connected in-parallel. The mosaic sensors, which are manufactured by nano-fabrication methods in CMOS FABs, exhibit enhanced performance and robust manufacturing in wafer level processing and vacuum packaging. Since the sub-pixels are thermally isolated, the thermal time constant of the large pixel is determined by that of the sub-pixel, which is sim {mathrm 80} msec when packaged in vacuum of sim 1{mathrm Pa}. For outdoor operation, two identical large pixels are differentially measured. The pixels view the detected scene with an optics that may be based either on mirror optics or Fresnel plastic lenses. The optics defines a narrow field of view (± 3 degrees) as required for curtain sensors. Furthermore, the optics forms 'cockeyed' vision which enables differential measurement that cancels the environmental' noise' and allows outdoor operation. The overall measured performance for detecting human targets at extended ranges and hot spots detection are reported. This sensor outperforms thermopiles and pyroelectric sensors at outdoor operation.
AB - This paper presents a non-imaging differential digital passive Infra-Red (PIR) remote sensing system using CMOS-SOI-MEMS transistors as the thermal sensor. A large 660mu {mathrm m}, {mathrm x}, 660mu{mathrm m} pixel area is developed by the 8x8 mosaic matrix of 60mu {mathrm m} ,{mathrm x}, 60mu{mathrm m} sub-pixels connected in-parallel. The mosaic sensors, which are manufactured by nano-fabrication methods in CMOS FABs, exhibit enhanced performance and robust manufacturing in wafer level processing and vacuum packaging. Since the sub-pixels are thermally isolated, the thermal time constant of the large pixel is determined by that of the sub-pixel, which is sim {mathrm 80} msec when packaged in vacuum of sim 1{mathrm Pa}. For outdoor operation, two identical large pixels are differentially measured. The pixels view the detected scene with an optics that may be based either on mirror optics or Fresnel plastic lenses. The optics defines a narrow field of view (± 3 degrees) as required for curtain sensors. Furthermore, the optics forms 'cockeyed' vision which enables differential measurement that cancels the environmental' noise' and allows outdoor operation. The overall measured performance for detecting human targets at extended ranges and hot spots detection are reported. This sensor outperforms thermopiles and pyroelectric sensors at outdoor operation.
KW - CMOS-SOI-MEMS
KW - infrared (IR) mirror optics
KW - MOS transistors
KW - mosaic sensor
KW - passive infrared (PIR) sensors
KW - uncooled infrared (IR) sensors
UR - https://www.scopus.com/pages/publications/85142489596
U2 - 10.1109/ISCAS48785.2022.9937636
DO - 10.1109/ISCAS48785.2022.9937636
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AN - SCOPUS:85142489596
T3 - Proceedings - IEEE International Symposium on Circuits and Systems
SP - 1175
EP - 1179
BT - IEEE International Symposium on Circuits and Systems, ISCAS 2022
T2 - 2022 IEEE International Symposium on Circuits and Systems, ISCAS 2022
Y2 - 27 May 2022 through 1 June 2022
ER -