@inproceedings{810d4307a8594c9b97fb32a3aafce01f,
title = "Vertically integrated silicon single crystalline MEMS switch",
abstract = "DC to RF shunt contact Micro-Electro-Mechanical switch was fabricated. The fabrication of the MEMS device was preformed using bulk micromachining process of an SOI wafer followed by a vertical integration to a microwave circuit wafer. The pull-in voltage and natural frequency of the switch were characterized. Also, RF performances at both switch states were measured. The concept of a packaged switch described in this paper enables to offer a stand alone switch, independent of the RF circuit substrate material or technology being used.",
keywords = "DRIE, RF-MEMS, SOI, Switch",
author = "Oren Aharon and Shai Feldman and Yael Nemirovsky",
year = "2005",
doi = "10.1109/SENSOR.2005.1496635",
language = "אנגלית",
isbn = "0780389948",
series = "Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05",
pages = "1047--1050",
booktitle = "TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers",
note = "13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 ; Conference date: 05-06-2005 Through 09-06-2005",
}