A Design Flow and Tool for Avoiding Asymmetric Aging

Freddy Gabbay, Avi Mendelson, Basel Salameh, Majd Ganaiem

Research output: Contribution to journalArticlepeer-review

Abstract

Advance process nodes may incur severe reliability concerns due to asymmetric aging, which induces unequal timing degradation of logic elements over time. Most existing tools can handle asymmetric aging in relatively small circuitry and rely on a physical design approach. This paper extends asymmetric aging avoidance design flows using automated engineering change order (ECO) flow. The proposed tool and design flow can be simply integrated as part of standard flows of large-scale integrated circuits. Our experimental analysis of various data-path logic structures reveals that the tool can eliminate reliability issues while introducing minor overhead.

Original languageEnglish
Pages (from-to)111-118
Number of pages8
JournalIEEE Design and Test
Volume39
Issue number6
DOIs
StatePublished - 1 Dec 2022

Keywords

  • Asymmetric Aging
  • Bias Temperature Instability
  • EDA
  • Electronic Design Automation
  • Reliability

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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