Abstract
An electrostaticly driven micro resonator is fabricated from single-crystal silicon, using micromachining techniques. The displacement amplitude is measured through a differential capacitance measurement, implemented on a CMOS interface circuit, which also provides the excitation clocks for the resonator. The unique feature of this micromechanical system is the integration method applied for attaching the resonator to the CMOS chip. The integration is based upon indium bumps technology, which is now established in modules of infra-red focal plane arrays. A technology which is extended here for the first time, to the best of our knowledge, to micro electro mechanical systems.
Original language | English |
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Title of host publication | Proceedings of the 18th Convention of Electrical and Electronics Engineers in Israel |
Pages | 2.5.2/1-5 |
State | Published - 1995 |
Event | Proceedings of the 18th Convention of Electrical and Electronics Engineers in Israel - Tel Aviv, Isr Duration: 7 Mar 1995 → 8 Mar 1995 |
Conference
Conference | Proceedings of the 18th Convention of Electrical and Electronics Engineers in Israel |
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City | Tel Aviv, Isr |
Period | 7/03/95 → 8/03/95 |
ASJC Scopus subject areas
- General Engineering